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[CN 201880069761.9] Balanced Adaptation Force Mechanism for Integrated Circuit Packaging Work Press Test System
[CN 201880069761.9] Title of Balanced Adaptation Mechanism for Integrated Circuit Packaging Work Press Test System: Application Number of Balanced Adaptation Mechanism for Integrated Circuit Packaging Work Press Test System: CN 201880069761.9 Applicant: Cyrance Company Application Date: 2018-10-25 Patent Type: Invention Application This paper describes an integrated chip package component test system (100) and a method for testing chip package components. In one example, an integrated circuit chip package testing system (100) includes a socket (120) and a work press (106). The socket (120) is configured to receive a chip package assembly (160) for testing in a test system (100). A work press (106) is positioned over the socket (120) and has a bottom surface (116) that dynamically adapts the multi-planar top surface topography of the chip package assembly (160).
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